Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:88
88+
$1.18162
11-14 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:93
93+
$1.18162
11-13 Days
Boyd
Batch：2543
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:352
MOQ:352
352+
$1.48786
11-14 Days
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