Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2552
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$0.88473
6720+
$0.8758
10080+
$0.86709
More
7-10 Days
Boyd
Batch：2552
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$1.54642
11-14 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$1.60181
9-12 Days
Inquiry
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