Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2450
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:336
MOQ:336
336+
$0.94952
5376+
$0.86768
8064+
$0.8074
11-14 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:88
88+
$1.18162
11-14 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:93
93+
$1.18162
11-13 Days
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