Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$0.91287
6720+
$0.89796
10080+
$0.89008
More
7-10 Days
Boyd
Batch：2440
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$0.92809
6720+
$0.91203
10080+
$0.90331
More
7-10 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:3360
MOQ:3360
3360+
$0.95909
6720+
$0.94336
10080+
$0.93511
More
11-14 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:88
88+
$1.25004
11-13 Days
Boyd
Batch：2352
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
MPQ:1
MOQ:88
88+
$1.45486
11-14 Days
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