Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch:2244
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized
MPQ:1
MOQ:20
10+
$0.96758
25+
$0.93815
11-13 Days
Boyd
Batch:2244
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum Black Anodized
MPQ:1
MOQ:10
10+
$0.96758
11-14 Days
Inquiry
| Part No | Quantity | Manufacturer |
|---|---|---|