Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:60
60+
$2.407
11-13 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:55
55+
$2.407
9-12 Days
Boyd
Batch：2602
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:168
MOQ:336
336+
$2.9968
7-10 Days
Boyd
Batch：2602
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:336
MOQ:336
336+
$5.67588
11-14 Days
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