- Brand
Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：1342
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:96
96+
$1.26773
11-14 Days
Pulse
Batch：1631
Common Mode Chokes Dual 13000uH 51.22kOhm 1A 0.295Ohm DCR Thru-Hole
MPQ:1
MOQ:93
1+
$1.59369
11-13 Days
Pulse
Batch：2330
Common Mode Chokes Dual 1280uH 5.04kOhm 4A 0.0255Ohm DCR Thru-Hole
MPQ:1
MOQ:600
600+
$2.163
950+
$2.079
2400+
$2.0664
7-10 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:55
55+
$2.407
11-14 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
MPQ:1
MOQ:60
60+
$2.407
11-13 Days
Pulse
COMMON MODE CHOKE 4A 2LN TH
MPQ:50
MOQ:1
1+
$4.8614
10+
$3.99376
25+
$3.6951
More
9-13 Days
Pulse
2 线路共模扼流圈 通孔 1A DCR 295 毫欧
MPQ:50
MOQ:1
1+
$4.8614
10+
$3.99376
25+
$3.6951
More
9-13 Days
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