Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2521
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
MPQ:216
MOQ:1080
1080+
$2.6019
2160+
$2.57565
2592+
$2.55045
More
7-10 Days
Boyd
散热片 BGA Solder Anchor, 27x27x18mm, Black Anodized, 2 Anchors, IC Pkg Size = 27 x 27
MPQ:216
MOQ:1
1+
$3.1968
216+
$2.9592
13-15 Days
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