Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2604
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
MPQ:216
MOQ:1080
1080+
$2.74638
7-10 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
MPQ:216
MOQ:1080
1080+
$3.7191
2592+
$3.36735
5184+
$3.1311
7-10 Days
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