Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
散热片 BGA 铝 4.0W @ 80°C 顶部安装
MPQ:1
MOQ:1
1+
$3.94163
100+
$3.86174
250+
$3.78517
More
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3°C/W Black Anodized
MPQ:1
MOQ:6
6+
$18.51548
10+
$14.24277
9-12 Days
Inquiry
| Part No | Quantity | Manufacturer |
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