Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:1
MOQ:66
59+
$1.85119
100+
$1.77474
500+
$1.72216
More
11-13 Days
Boyd
Batch：2524
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:756
MOQ:2268
2268+
$1.81062
7-10 Days
Boyd
Batch：2229
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:1
MOQ:66
66+
$1.85119
11-14 Days
Boyd
散热片 BGA，FPGA 铝 3.0W @ 90°C 插件板级
MPQ:756
MOQ:1
1+
$4.8168
10+
$4.7196
25+
$4.0068
More
13-15 Days
Boyd
Batch：2524
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:2268
MOQ:2268
2268+
$2.74813
11-14 Days
Inquiry
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