Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch:2603
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:139
MOQ:139
139+
$3.48913
11-14 Days
Inquiry
| Part No | Quantity | Manufacturer |
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