Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
散热片 BGA 铝 2.0W @ 50°C 顶部安装
MPQ:560
MOQ:1
1+
$3.4344
10+
$2.9916
100+
$2.8512
More
13-15 Days
Boyd
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:560
MOQ:1680
1680+
$1.7934
2800+
$1.79287
5040+
$1.79203
7-10 Days
Boyd
Batch：2529
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:560
MOQ:1680
1680+
$1.7934
2800+
$1.79287
5040+
$1.79203
7-10 Days
Inquiry
| Part No | Quantity | Manufacturer |
|---|---|---|
Please provide following contact information.
Company Name:
Contact Name:
Tel:
E-mail:
Message:
Verification: