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374124B00035G
Boyd
散热片 BGA 铝 2.0W @ 50°C 顶部安装
MPQ:560
MOQ:1
1+
$6.2532
100+
$5.7348
250+
$2.808
560+
$2.376
2800+
$1.6308
5040+
$1.566
More
13-15 Days
Inquiry
374124B00035G
Boyd
Batch：2529
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:560
MOQ:1120
1120+
$1.79266
1680+
$1.77471
3920+
$1.75696
14000+
$1.73943
28000+
$1.722
70000+
$1.70478
More
7-10 Days
Inquiry
374124B00035G
Boyd
散热片 BGA 铝 2.0W @ 50°C 顶部安装
MPQ:1
MOQ:1
1+
$1.87127
8-12 Days
Inquiry
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