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374124B00035G
Boyd
Batch：2551
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
MPQ:560
MOQ:1680
1680+
$1.41939
7-10 Days
Inquiry
374124B00035G
Boyd
散热片 BGA 铝 2.0W @ 50°C 顶部安装
MPQ:1
MOQ:1
1+
$1.97482
8-12 Days
Inquiry
374124B00035G
Boyd
散热片 BGA 铝 2.0W @ 50°C 顶部安装
MPQ:1
MOQ:1
1+
$1.97482
9-10 Days
Inquiry
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