BB135,115
In stock
- BB135,115 Details
- Packing And Shipping
- Payment Method
- Quality Control
Specification
| Package | SOD-323 |
| junction capacitance | 2.1pF |
| Operating Temperature-Min | -55℃ |
| Operating Temperature-Max | +125℃ |
| Vr-reverse voltage | 30V |
| Operating Temperature Range | -55℃~+125℃ |
| 工厂最小包装 | 3000 |
| 寿命周期 | 量产 |
| ROHS | no |
| VRWM | 30V |
| Capacitance ratio | 12 |
| Termination type | 贴片 |
Others include "BB135,115" parts
The following parts include 'BB135,115'
BB135,115 Releted Information
- Popular Products
FEATURED PRODUCT SOMRON
-
-
-
S9S12XS256J0VALR
NXP
MCU 16-bit HCS12X CISC 256KB Flash 5V Automotive AEC-Q100 112-Pin LQFP T/R
Learn More >
-
-
-
-
CWA-LS-DVLPR-NL
NXP
CodeWarrior MPC83xx/MPC85xx/Power Architecture/QorIQ/QorIQ Accelerator/StarCore/QorIQ LS2/QorIQ LS1 ARMv7 Microprocessor/Microcontroller IDE Software
Learn More >
-
-
-
-
S9S12XS256J0VAA
NXP
MCU 16-bit HCS12X CISC 256KB Flash 5V Automotive AEC-Q100 80-Pin PQFP Tray
Learn More >
-
-
-
-
MC9S08PA8AVLD
NXP
IC MCU 8BIT 8KB FLASH 44LQFP
Learn More >
-
-
-
-
1323XNSK-SFTW
NXP
MC1323x 802.15.4 LR-WPAN Development Kit
Learn More >
-
-
-
-
SPC5121YVY400B
NXP
IC MCU 32BIT ROMLESS 516TEPBGA
Learn More >
-
-
-
-
TJA1042T/3/1J
NXP
半双工,5Mbps TJA1042T/3/1
Learn More >
-
-
-
-
13234NSK-BDM
NXP
MC13234/MC13237 802.15.4 LR-WPAN Development Kit
Learn More >
-
-
-
-
TWR-KM34Z50MV3
NXP
A TOWER FORM FACTOR MCU MODULE
Learn More >
-
-
-
-
13226PRO-DBG
NXP
MC13226 802.15.4 LR-WPAN Development Kit
Learn More >
-
-
View All Newest Products from Omron