MP157GS-Z

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Specification
Termination type | 表面贴装型 |
Package | SOIC-8 |
Power topology | 升压,降压,降压升压,反激 |
Function | 非隔离 |
Operating Temperature Range | -40°C~125°C(TJ) |
工厂最小包装 | 2500 |
寿命周期 | 量产 |
ROHS | no |
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