MP157GS-Z
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Specification
| Termination type | 表面贴装型 |
| Package | SOIC-8 |
| Power topology | 升压,降压,降压升压,反激 |
| Function | 非隔离 |
| Operating Temperature Range | -40°C~125°C(TJ) |
| 工厂最小包装 | 2500 |
| 寿命周期 | 量产 |
| ROHS | no |
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