Part No
Brand
Specification
MPQ|MOQ
Quantity
US Dollar
Delivery Date
Operation
Boyd
Batch:2529
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
MPQ:216
MOQ:1080
1080+
$2.32092
7-10 Days
Boyd
散热片 BGA,FPGA 铝 1.5W @ 50°C 插件板级
MPQ:216
MOQ:1
1+
$5.0544
10+
$5.0112
25+
$4.752
More
13-15 Days
Inquiry
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